此款设备是针对PC主板测试（常温、高温、低温），以6/12/16工位进行并测的IC分选机
| Model | SUMMIT-3100 | |||
|---|---|---|---|---|
| Test Site Quantity | 6/12/16 (Base on Differenet Model) | |||
| Temp type | Ambient&High-Temp | |||
| UPH | Max.2500(12site) | |||
| Index Time | Min.4s | |||
| Contact Force | MAX.120KG/site | |||
| Rotator Function | 90°，180°，-90° | |||
| Test Board Dimension | 6 site: Max 568mmx500m, 12 site: Max 290mmx500m, 16 site: Max 206mmx500mm | |||
| PKG Type | QFN,QFP,BGA,LGA,PLCC,PGA, CSP,TSOP etc | |||
| PKG Size | From 4x4 to 100x100 mm | |||
| Jam Rate | <1 /5000 | |||
| Tray Type | Jedec tray | |||
| Temp Range | 25degC to +130degC ±3degC | |||
| Temperature accuracy | ±1degC | |||
| Num Of Sorting | Auto Tray×4 | |||
| Multi Bin Module (Option: +Multi Bin Module) | Auto Tray×2；Fix Tray×15 | |||
| Tester Interface | RS-232，Network | |||
| Heating Rate (Option: +ATC) | Ambient~125℃ < 60s | |||
| Cooling Rate (Option: +ATC) | 125~Ambient< 120s | |||
| Heat Dissipation (Option: +ATC) | 200W@25℃，400W@70℃，450W@125℃(Contact size: 40 x 40mm) | |||
| Heating Rate (Option: +Tri-temp) | Ambient~125℃ < 15min | |||
| Cooling Rate (Option: +Tri-temp) | Ambient~-55℃ < 30min | |||
| Heat Dissipation (Option: +Tri-temp) | 150W@-55℃，400W@25℃，400W@125℃(Contact size: 65 x 65mm) | |||
